Capabilities
| Board Types Manufactured | Multilayer, PTH, Conventional |
| Surface Finishes | HASL, Electroless Nickel /Gold, Organic Silver, Black Oxide, Glicoat |
| Solder Resist Types | Photo-Imageable, U.V. Cured, 2 Pack Epoxy |
| Annotation Types | Single Pack Epoxy, Photo-Imageable, U.V. Cured |
| Removable Solder Mask | Peelable Mask, Water Soluble Mask |
| Layers | 1 Layer to 16 Layers |
| Material | FR4 Glass Fibre, FR2 Phenolic Paper, CEM All Grades |
| Profile | CNC Routing, V-Score |
| Approvals | ISO 9002 Approved, UL Recognised Component |
| Full Laboratory Testing | All tests are performed in accordance with BS6221 |
| Etching | Ammonical etch constant speed. |
| Copper Weight * | 18 microns to 70 microns | |
| Maximum Circuit Size * | 55.8 cm * 30.5 cm | |
| Minimum Track Width * | 0.2 mm | |
| Minimum Hole Size | * 0.4 mm | |
| Minimum Gap * | 0.2 mm | |
| Maximum Aspect Ratio * | 4 : 1 | |
| Copper Minimum Thickness | 20 microns | |
| * These are regarded as standard values. Other values can be achieved by discussion. | ||
| Tin/Lead Minimum Thickness | 5 microns | |
| Gold Thickness [Tab Plating] | 0.2 to 5 microns | |
| Nickel Thickness [Tab Plating] | 1 to 8 microns | |
| Minimum Annular Ring | 0.325 mm larger than hole size | |
| Solder Resist Clearance- Imageable | 0.050 mm [Recommended] | |
| Solder Resist Clearance- Wet | 0.150 mm [Recommended] | |
| Drilling & Profiling | |
| Drill positional accuracy. | ± 0.05 from program position |
| Rout positional accuracy. | ± 0.10 from program position |
| Specifications & Tolerances | |
| Minimum Track/Gap | .004”/.004” |
| Minimum Hole Size | .008” |
| Minimum Feature to Edge | .010” |
| Minimum Thickness Tolerance | .010” |
| Plated Through Hole Tolerance | .003” |
| Minimum Soldermask Clearance | .004” |
| Controlled Impedance Tolerance | 10% |
| Minimum Pad to PTH | .006” |
| Tighter tolerances are achievable by design |
Multilayer Capabilities
Multilayer 3 to 40 layers-buried and blind vias`s Thickness 0.20mm to 8.0mm
Inner Layer Copper Weight
- 12µ
- 18µ / ˝oz
- 35µ / 1oz
- 70µ / 2oz
- 105µ / 3oz
- 140µ / 4oz
- others on request
Outer Layer Copper Weight
- 5µ
- 9µ / Ľoz
- 12µ
- 18µ / ˝oz
- 35µ / 1oz
- 70µ / 2oz
- 105µ / 3oz
- 140µ / 4oz
- others on request
Materials
- CEM1
- CEM3
- FR2
- FR4
- FR4 Halogen Free
- FR5 (High TG & High Frequency)
- Aluminium Based
- Aramids
- Arlon 25N/25FR
- Nelco Materials
- Polyimide
- PTFE
- Rogers Materials
Finishes
- OSP (Organic Solderability Preservative)
- Immersion Silver
- Electroless Nickel/Immersion Gold(E.N.I.G.)
- Immersion Tin
- Hard Gold(also to Def.Stan.03-17)
- Soft Gold
- Lead-Free HASL(SN100C)
- Tin/Lead HASL(not RoHS compliant)
Bare Board Test
Utilising ATG A3 flying probe test systems. Fixture testing also available.
Delivery Time
- 24 hrs
- 48 hrs
- 3 days
- 5 days
- 7 days
- 10 days
- 15 days
PCB Types and RoHS Compliant finishes
- Single sided
- Double sided
- Plated through hole
- Multilayer 3 to 40 layers.Blind and buried via`s
- Controlled Impedance
- Immersion silver
- Electroless Nickel/Immersion Gold
- Lead Free Hot Air Solder Level (H.A.S.L.)
- Tin/Lead H.A.S.L.(NOT RoHS Compliant)
- Electroplated Nickel/Gold
- Electroplated Hard Gold
- Carbon Conductive Ink
- Peelable Mask